JPH0361315B2 - - Google Patents
Info
- Publication number
- JPH0361315B2 JPH0361315B2 JP16019085A JP16019085A JPH0361315B2 JP H0361315 B2 JPH0361315 B2 JP H0361315B2 JP 16019085 A JP16019085 A JP 16019085A JP 16019085 A JP16019085 A JP 16019085A JP H0361315 B2 JPH0361315 B2 JP H0361315B2
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- electronic circuit
- circuit members
- sandwiched
- conductive fine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 239000010419 fine particle Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 5
- 230000005684 electric field Effects 0.000 claims description 4
- 238000009413 insulation Methods 0.000 description 6
- 239000002923 metal particle Substances 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000006247 magnetic powder Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16019085A JPS6222383A (ja) | 1985-07-22 | 1985-07-22 | 電子回路部材の接続方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16019085A JPS6222383A (ja) | 1985-07-22 | 1985-07-22 | 電子回路部材の接続方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6222383A JPS6222383A (ja) | 1987-01-30 |
| JPH0361315B2 true JPH0361315B2 (en]) | 1991-09-19 |
Family
ID=15709765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16019085A Granted JPS6222383A (ja) | 1985-07-22 | 1985-07-22 | 電子回路部材の接続方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6222383A (en]) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0740496B2 (ja) * | 1989-03-01 | 1995-05-01 | シャープ株式会社 | 電極上への導電性粒子の配置方法 |
| JP2008112732A (ja) * | 2007-11-19 | 2008-05-15 | Hitachi Chem Co Ltd | 電極の接続方法 |
| JP2010028015A (ja) * | 2008-07-24 | 2010-02-04 | Toppan Forms Co Ltd | 部品実装基板の製造方法 |
| JP4581016B2 (ja) * | 2009-03-25 | 2010-11-17 | 株式会社東芝 | 半導体チップ実装体、半導体チップ実装体の製造方法および電子機器 |
| US9818499B2 (en) * | 2011-10-13 | 2017-11-14 | Flexcon Company, Inc. | Electrically conductive materials formed by electrophoresis |
| JP7476340B2 (ja) | 2020-03-25 | 2024-04-30 | フレクスコン カンパニー インク | 等方性非水性電極用センシング素材 |
-
1985
- 1985-07-22 JP JP16019085A patent/JPS6222383A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6222383A (ja) | 1987-01-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0361315B2 (en]) | ||
| JP2598030B2 (ja) | 液晶表示装置 | |
| JPH04292803A (ja) | 異方導電性フィルム | |
| JPS60170176A (ja) | 透明導電膜との接続構造体 | |
| JPS63170875A (ja) | フラツト電線と金属端子のスポツト溶接方法 | |
| JPS6386322A (ja) | 導電異方性接着剤シ−ト | |
| KR940001260B1 (ko) | 도전용 결합제 및 도전접속 구조 | |
| JPH0529386A (ja) | 被着体の接続端子部の接続構造 | |
| JPH0334064Y2 (en]) | ||
| JPH034576A (ja) | 積層型圧電素子 | |
| JP3156477B2 (ja) | 導電フィルム及びその製造方法 | |
| JP3198162B2 (ja) | 半導体集積回路装置の接続方法 | |
| WO1994030034A1 (fr) | Procede de raccordement electrique, carte a circuits electriques, et colle pour la mise en oeuvre du procede | |
| JPH10261852A (ja) | ヒートシールコネクタとフレキシブル配線板 | |
| JP3438583B2 (ja) | 異方導電性フィルムの接続方法 | |
| US3287794A (en) | Method of soldering semiconductor discs | |
| JPS608377A (ja) | 異方導電性接着剤 | |
| JPH0636613A (ja) | 電子部品用接合材料およびそれを用いた電子機器 | |
| JPS6011402B2 (ja) | 異方導電性シ−ト | |
| JPS61277179A (ja) | 導電異方性接着シ−ト | |
| JPH02103875A (ja) | 異方性導電材 | |
| JP2000012613A (ja) | 異方性導電接着剤および電子部品の実装方法 | |
| JP3059744B2 (ja) | 液晶表示装置 | |
| JP2973678B2 (ja) | 配線パターンの接続法 | |
| JP3229902B2 (ja) | 液晶表示装置の接続方法および液晶表示装置の製造装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |